updated sbc model framework for h2 and h3 pcb thickness increase, changed bottom_height calc to include pcb thickness.
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Submodule SBC_Model_Framework updated: f9d1a4950d...78ed9b4129
@@ -183,7 +183,7 @@ pcb_bmaxz = sbc_data[s[0]][6];
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width = pcb_width+2*(wallthick+gap)+case_offset_x;
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width = pcb_width+2*(wallthick+gap)+case_offset_x;
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depth = pcb_depth+2*(wallthick+gap)+case_offset_y;
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depth = pcb_depth+2*(wallthick+gap)+case_offset_y;
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top_height = pcb_tmaxz+floorthick+case_offset_tz;
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top_height = pcb_tmaxz+floorthick+case_offset_tz;
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bottom_height = pcb_bmaxz+floorthick+case_offset_bz;
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bottom_height = pcb_z+pcb_bmaxz+floorthick+case_offset_bz;
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case_z = bottom_height+top_height;
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case_z = bottom_height+top_height;
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case_diameter = sqrt(pow(width-wallthick-gap,2)+pow(depth-wallthick-gap,2));
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case_diameter = sqrt(pow(width-wallthick-gap,2)+pow(depth-wallthick-gap,2));
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hex_diameter = sqrt(pow(width+2*(wallthick+gap),2)+pow(depth+2*(wallthick+gap),2));
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hex_diameter = sqrt(pow(width+2*(wallthick+gap),2)+pow(depth+2*(wallthick+gap),2));
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