Jean-Francois Dagenais 4f8d374b77 hwmon: (max6650) add thermal cooling device capability
This allows max6650 devices to be referenced in dts as a cooling device.

The pwm value seems duplicated in cooling_dev_state but since pwm goes
through rounding logic into data->dac, it is modified and messes with
the thermal zone state algorithms. It's also better to serve a cache
value, thus avoiding periodic actual i2c traffic.

Signed-off-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
2019-04-20 07:08:15 -07:00
2019-03-07 18:32:03 -08:00
2019-04-05 16:02:31 -10:00
2019-04-02 18:12:44 -10:00
2019-04-07 14:09:59 -10:00

Linux kernel
============

There are several guides for kernel developers and users. These guides can
be rendered in a number of formats, like HTML and PDF. Please read
Documentation/admin-guide/README.rst first.

In order to build the documentation, use ``make htmldocs`` or
``make pdfdocs``.  The formatted documentation can also be read online at:

    https://www.kernel.org/doc/html/latest/

There are various text files in the Documentation/ subdirectory,
several of them using the Restructured Text markup notation.

Please read the Documentation/process/changes.rst file, as it contains the
requirements for building and running the kernel, and information about
the problems which may result by upgrading your kernel.
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