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The Processor Thermal PCI device supports multiple features. Currently we export only RAPL. But we need more features from this device exposed for Tiger Lake and Alder Lake based platforms. So re-structure the current MMIO interface, so that more features can be added cleanly. No functional changes are expected with this change. Changes done in this patch: - Using PCI_DEVICE_DATA(), hence names of defines changed - Move RAPL MMIO code to its own module - Move the RAPL MMIO offsets to RAPL MMIO module - Adjust Kconfig dependency of PROC_THERMAL_MMIO_RAPL - Per processor driver data now contains the supported features - Moved all the common data structures and defines to a common header file - This new header file contains all the processor_thermal_* interfaces - Based on the features supported the module interface is called - Each module atleast provides one add and one remove function Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20201126171829.945969-1-srinivas.pandruvada@linux.intel.com
Linux kernel
============
There are several guides for kernel developers and users. These guides can
be rendered in a number of formats, like HTML and PDF. Please read
Documentation/admin-guide/README.rst first.
In order to build the documentation, use ``make htmldocs`` or
``make pdfdocs``. The formatted documentation can also be read online at:
https://www.kernel.org/doc/html/latest/
There are various text files in the Documentation/ subdirectory,
several of them using the Restructured Text markup notation.
Please read the Documentation/process/changes.rst file, as it contains the
requirements for building and running the kernel, and information about
the problems which may result by upgrading your kernel.